Chengwen He

17 papers and 429 indexed citations i.

Chengwen He has authored 17 papers that have received a total of 429 indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 3 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (5 papers). Chengwen He is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (5 papers) and collaborates with scholars based in China, United States and Canada. Chengwen He's co-authors include Yonghuan Guo, Jiguang Han, Jun Cai and Yunbin Yuan and has published in prestigious journals such as Materials Science and Engineering A, Sensors and IEEE Access.