B. Kempf
About
B. Kempf has authored 20 papers that have received a total of 308 indexed citations.
This includes 12 papers in Mechanical Engineering, 9 papers in Electrical and Electronic Engineering and 5 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), Electrical Contact Performance and Analysis (5 papers) and Advanced materials and composites (4 papers). B. Kempf is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Electrical Contact Performance and Analysis (5 papers) and Advanced materials and composites (4 papers) and collaborates with scholars based in Germany and Belgium. B. Kempf's co-authors include Markus Rettenmayr, Kim Vanmeensel, Jef Vleugels, Ludo Froyen and F. Heringhaus and has published in prestigious journals such as Acta Materialia, Journal of Alloys and Compounds and Journal of Materials Processing Technology.
In The Last Decade
Fields of papers published by B. Kempf
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by B. Kempf
Since SpecializationCitations
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