Alice C. Kilgo
About
Alice C. Kilgo has authored 20 papers that have received a total of 380 indexed citations.
This includes 16 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 5 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers) and Aluminum Alloys Composites Properties (4 papers). Alice C. Kilgo is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers) and Aluminum Alloys Composites Properties (4 papers) and collaborates with scholars based in United States. Alice C. Kilgo's co-authors include Paul T. Vianco, Jerome A. Rejent, Richard Grant, Charles A. Walker and Benjamin B. Yang and has published in prestigious journals such as Journal of materials research/Pratt's guide to venture capital sources, Materials and Journal of Electronic Materials
In The Last Decade
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