A. F. Bower

55 papers and 3.5k indexed citations i.

A. F. Bower has authored 55 papers that have received a total of 3.5k indexed citations. This includes 28 papers in Mechanics of Materials, 19 papers in Electrical and Electronic Engineering and 19 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), Copper Interconnects and Reliability (11 papers) and Adhesion, Friction, and Surface Interactions (11 papers). A. F. Bower is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Copper Interconnects and Reliability (11 papers) and Adhesion, Friction, and Surface Interactions (11 papers) and collaborates with scholars based in United States, United Kingdom and Singapore. A. F. Bower's co-authors include M. Ortíz, Yong‐Wei Zhang, Pradeep R. Guduru, Yanfei Gao and Vijay A. Sethuraman and has published in prestigious journals such as The Journal of Chemical Physics, Nature Communications and Applied Physics Letters.