Photonic band gaps in three dimensions: New layer-by-layer periodic structures
Impact in
Classified as
- Journal
- Solid State Communications
In The Last Decade
doi.org/10.1016/0038-1098(94)90202-x →Countries where authors are citing Photonic band gaps in three dimensions: New layer-by-layer periodic structures
This map shows the geographic impact of Photonic band gaps in three dimensions: New layer-by-layer periodic structures. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Photonic band gaps in three dimensions: New layer-by-layer periodic structures with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Photonic band gaps in three dimensions: New layer-by-layer periodic structures more than expected).
Fields of papers citing Photonic band gaps in three dimensions: New layer-by-layer periodic structures
This network shows the impact of Photonic band gaps in three dimensions: New layer-by-layer periodic structures. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the Photonic band gaps in three dimensions: New layer-by-layer periodic structures.
About Photonic band gaps in three dimensions: New layer-by-layer periodic structures
This paper, published in 1994, received 604 indexed citations . Written by K. M. Ho, C. T. Chan, C. M. Soukoulis, R. Biswas and M. M. Sigalas covering the research area of Surfaces, Coatings and Films, Atomic and Molecular Physics, and Optics and Electrical and Electronic Engineering. It is primarily cited by scholars working on Atomic and Molecular Physics, and Optics (543 citations), Electrical and Electronic Engineering (448 citations), Surfaces, Coatings and Films (188 citations), Biomedical Engineering (179 citations) and Ecology, Evolution, Behavior and Systematics (72 citations). Published in Solid State Communications.
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This paper is also available at doi.org/10.1016/0038-1098(94)90202-x.